Custom Sputtering Targets

Custom Sputtering Targets Solution

Advanced Targets specialize in manufacturing custom sputtering targets tailored to meet the specific needs of your thin-film deposition processes. Whether you're working on advanced semiconductor wafers, optical coatings, or R&D applications, we offer flexible solutions designed to match your technical requirements and system compatibility.

What Custom Sputtering Targets Service We Offer

Service Category	Details
Custom Materials	Pure Metals: Ti, Al, Cu, W, Mo, Ta, Ni, Cr Alloys: AlTi, TiW, NiCr, TaNb Compounds: ITO, TiN, AlN, TaN, ZnO, etc.
Customized Dimensions	Shapes: Round / Disc, Rectangular / Plate, Tubular / Rotatable Sizes: 1" to 12" (or larger) Thickness and edge design tailored to your requirements
Purity Levels	99.9%, 99.99%, and ultra-high purity 99.999% (depending on application sensitivity)
Bonding Services	Indium bonding (ideal for good thermal transfer) Elastomer bonding (suitable for some compound targets) Backplate materials: Cu, Mo, W, stainless steel
Surface Finish	Precision-machined and polished surfaces for uniform film deposition and system compatibility

Main Uses of Custom Sputtering Targets

Semiconductor Devices – Depositing metal and barrier layers (e.g., Al, Cu, TiN, TaN) for interconnects, contacts, and diffusion barriers in IC chips.
Thin-Film Transistors (TFTs) – Forming the active channel layer (e.g., ITO, IGZO, a-Si) and metal electrodes (e.g., Al, Mo) in flat-panel display backplanes.
Optical Coatings – Creating anti-reflection (AR) coatings, bandpass filters, mirrors, and high-reflection layers for lenses, cameras, and optical instruments.
Magnetic Storage Media – Depositing magnetic layers (e.g., CoCrPt, FePt) and protective carbon overcoats for hard disk drive platters.
Solar Cells – Forming transparent conductive oxides (TCOs like ITO, ZnO:Al), buffer layers (CdS), and metal contacts (Ag, Al) in photovoltaic devices.
MEMS & Sensors – Patterning piezoelectric films (AlN, ZnO), electrode layers (Pt, Au), and sacrificial layers for micro-mechanical systems and sensor structures.
Wear-Resistant and Decorative Coatings – Depositing hard coatings (TiN, CrN, AlTiN) for cutting tools, and decorative finishes (e.g., gold-like TiN, black Cr) on watches, hardware, and automotive parts.
Energy-Efficient Glass (Low-E Glass) – Coating glass with multiple thin layers (e.g., silver, ITO, Si₃N₄) to reflect infrared heat while transmitting visible light for building windows.

Main Steps in the Manufacturing of Custom Sputtering Targets

Step	Manufacturing Stage	Description
1	Raw Material Selection & Purification	High-purity raw materials (metals, alloys, compounds) are selected. Purification may involve chemical refining, vacuum melting, or zone refining.
2	Powder Preparation (if applicable)	For ceramic or composite targets, powders are prepared via solid-state reaction, sol-gel, or spray drying methods.
3	Forming	The material is shaped into a target blank using: hot pressing, cold isostatic pressing (CIP), casting (for metals), hot isostatic pressing (HIP), or sintering (for ceramics). The formed blank is sintered at high temperature to increase density and improve mechanical strength.
4	Hot Forging or Rolling (for metals)	Used to refine grain structure and improve material uniformity and sputtering behavior.
5	Machining & Surface Finishing	Precision machining to meet required dimensions, tolerances, and surface smoothness (Ra). Surface polishing is done for better film uniformity.
6	Bonding (if needed)	Targets are bonded to a backing plate using indium or elastomer bonding to improve heat dissipation during sputtering.
7	Inspection & Quality Control	Rigorous testing for: purity (using GDMS or ICP-MS), density, grain size, bonding strength, surface flatness and roughness.