Custom Sputtering Target Solution

We specialize in manufacturing custom sputtering targets tailored to meet the specific needs of your thin-film deposition processes. Whether you're working on advanced semiconductor wafers, optical coatings, or R&D applications, we offer flexible solutions designed to match your technical requirements and system compatibility.

What We Offer

Custom Materials

Choose from a wide range of pure metals, alloys, ceramics, and compound materials, including:

Metals: Ti, Al, Cu, W, Mo, Ta, Ni, Cr

Alloys: AlTi, TiW, NiCr, TaNb

Compounds: ITO, TiN, AlN, TaN, ZnO, etc.

Customized Dimensions

We provide targets in various shapes and sizes:

Round / Disc

Rectangular / Plate

Tubular / Rotatable

Sizes from 1" to 12" (or larger)

Thickness and edge design tailored to your requirements

Purity Levels

Available in 99.9%, 99.99%, and ultra-high purity 99.999%, depending on your application’s sensitivity.

Bonding Services

Need bonding to a backing plate? We offer:

Indium bonding (ideal for good thermal transfer)

Elastomer bonding (suitable for some compound targets)

Various backplate materials (Cu, Mo, W, stainless steel)

Surface Finish

Precision-machined and polished surfaces for uniform film deposition and system compatibility.

Main Uses of Sputtering Targets

Semiconductor Devices

Thin-Film Transistors (TFTs)

Optical Coatings

Magnetic Storage Media

Solar Cells

MEMS & Sensors

Wear-Resistant and Decorative Coatings

Energy-Efficient Glass (Low-E Glass)

Main Steps in the Manufacturing of Sputtering Targets

Raw Material Selection & Purification

High-purity raw materials (metals, alloys, compounds) are selected. Purification may involve chemical refining, vacuum melting, or zone refining.

Powder Preparation (if applicable)

For ceramic or composite targets, powders are prepared via solid-state reaction, sol-gel, or spray drying methods.

Forming

The material is shaped into a target blank using:

Hot pressing

Cold isostatic pressing (CIP)

Casting (for metals)

Hot isostatic pressing (HIP)

Sintering (for ceramics)

The formed blank is sintered at high temperature to increase density and improve mechanical strength.

Hot Forging or Rolling (for metals)

Used to refine grain structure and improve material uniformity and sputtering behavior.

Machining & Surface Finishing

Precision machining to meet required dimensions, tolerances, and surface smoothness (Ra). Surface polishing is done for better film uniformity.

Bonding (if needed)

Targets are bonded to a backing plate using indium or elastomer bonding to improve heat dissipation during sputtering.

Inspection & Quality Control

Rigorous testing for:

Purity (using GDMS or ICP-MS)

Density

Grain size

Bonding strength

Surface flatness and roughness