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Advanced Targets specialize in manufacturing custom sputtering targets tailored to meet the specific needs of your thin-film deposition processes. Whether you're working on advanced semiconductor wafers, optical coatings, or R&D applications, we offer flexible solutions designed to match your technical requirements and system compatibility.
| Service Category | Details |
|---|---|
| Custom Materials | Pure Metals: Ti, Al, Cu, W, Mo, Ta, Ni, Cr Alloys: AlTi, TiW, NiCr, TaNb Compounds: ITO, TiN, AlN, TaN, ZnO, etc. |
| Customized Dimensions | Shapes: Round / Disc, Rectangular / Plate, Tubular / Rotatable Sizes: 1" to 12" (or larger) Thickness and edge design tailored to your requirements |
| Purity Levels | 99.9%, 99.99%, and ultra-high purity 99.999% (depending on application sensitivity) |
| Bonding Services | Indium bonding (ideal for good thermal transfer) Elastomer bonding (suitable for some compound targets) Backplate materials: Cu, Mo, W, stainless steel |
| Surface Finish | Precision-machined and polished surfaces for uniform film deposition and system compatibility |
| Application | Common Materials | Typical Custom Requirements |
|---|---|---|
| Semiconductor | Si, Ti, Ta, W, Cu, Al, Co, Ni | High purity, low impurity, precise dimensions, stable sputtering rate |
| Optical Coating | SiO₂, TiO₂, Nb₂O₅, Ta₂O₅, ITO | Optical performance, composition control, surface quality |
| Display & Touch Panel | ITO, AZO, Mo, Al, Cu | Large-size target, high density, uniform deposition |
| Solar Thin Film | CIGS, CdTe, Mo, AZO, ITO | Large area coating, composition stability, long service life |
| PVD Decorative Coating | Ti, Cr, Zr, TiAl, AlCr | Alloy composition, coating color, wear resistance |
| Laboratory Research | Metals, alloys, ceramics, oxides | Small quantity, customized size, flexible specifications |
Semiconductor Devices – Depositing metal and barrier layers (e.g., Al, Cu, TiN, TaN) for interconnects, contacts, and diffusion barriers in IC chips.
Thin-Film Transistors (TFTs) – Forming the active channel layer (e.g., ITO, IGZO, a-Si) and metal electrodes (e.g., Al, Mo) in flat-panel display backplanes.
Optical Coatings – Creating anti-reflection (AR) coatings, bandpass filters, mirrors, and high-reflection layers for lenses, cameras, and optical instruments.
Magnetic Storage Media – Depositing magnetic layers (e.g., CoCrPt, FePt) and protective carbon overcoats for hard disk drive platters.
Solar Cells – Forming transparent conductive oxides (TCOs like ITO, ZnO:Al), buffer layers (CdS), and metal contacts (Ag, Al) in photovoltaic devices.
MEMS & Sensors – Patterning piezoelectric films (AlN, ZnO), electrode layers (Pt, Au), and sacrificial layers for micro-mechanical systems and sensor structures.
Wear-Resistant and Decorative Coatings – Depositing hard coatings (TiN, CrN, AlTiN) for cutting tools, and decorative finishes (e.g., gold-like TiN, black Cr) on watches, hardware, and automotive parts.
Energy-Efficient Glass (Low-E Glass) – Coating glass with multiple thin layers (e.g., silver, ITO, Si₃N₄) to reflect infrared heat while transmitting visible light for building windows.
| Selection Factor | What You Need to Confirm |
|---|---|
| Application | Semiconductor, optical coating, PVD, solar, display or research |
| Target Material | Required metal, alloy, ceramic or oxide material |
| Purity Requirement | Film performance and process requirements |
| Equipment Compatibility | Sputtering system model and target installation method |
| Target Dimension | Diameter, length, width and thickness |
| Deposition Method | DC sputtering, RF sputtering or magnetron sputtering |
| Quantity | Trial production or mass production |
| Step | Manufacturing Stage | Description |
|---|---|---|
| 1 | Raw Material Selection & Purification | High-purity raw materials (metals, alloys, compounds) are selected. Purification may involve chemical refining, vacuum melting, or zone refining. |
| 2 | Powder Preparation (if applicable) | For ceramic or composite targets, powders are prepared via solid-state reaction, sol-gel, or spray drying methods. |
| 3 | Forming | The material is shaped into a target blank using: hot pressing, cold isostatic pressing (CIP), casting (for metals), hot isostatic pressing (HIP), or sintering (for ceramics). The formed blank is sintered at high temperature to increase density and improve mechanical strength. |
| 4 | Hot Forging or Rolling (for metals) | Used to refine grain structure and improve material uniformity and sputtering behavior. |
| 5 | Machining & Surface Finishing | Precision machining to meet required dimensions, tolerances, and surface smoothness (Ra). Surface polishing is done for better film uniformity. |
| 6 | Bonding (if needed) | Targets are bonded to a backing plate using indium or elastomer bonding to improve heat dissipation during sputtering. |
| 7 | Inspection & Quality Control | Rigorous testing for: purity (using GDMS or ICP-MS), density, grain size, bonding strength, surface flatness and roughness. |
Strict QC & traceability – Partner with national lab, powder metallurgy, GDMS/ICP-MS testing.
Fast prototype & small batch – Short lead time via powder route + CAS R&D support.
Scalable mass production – High-Tech Enterprise, stable output of multi-component alloys.
New material development support – Joint R&D with CAS & USTB, help solve sputtering issues.
Flexible MOQ & global shipping – Low MOQ, export compliant, customer-first service.
You should provide target material, purity requirement, dimensions, application, sputtering equipment model and quantity. These details help us recommend the most suitable target solution.
Yes. Custom sputtering targets can be produced according to your existing sputtering system specifications, including shape, size and bonding requirements.
We provide customized sputtering targets in metals, alloys, ceramics and oxide materials, including aluminum, titanium, chromium, silicon, ITO, AZO and other materials.
Purity requirements depend on the application. Semiconductor and electronic applications usually require higher purity levels, while decorative coating applications may have different requirements.
Yes. Custom sputtering targets can be supplied for laboratory testing, R&D projects and pilot production.
Common customized shapes include:
Circular targets
Rectangular targets
Rotary targets
Special-shaped targets
Yes. Bonding options can be customized according to your sputtering equipment requirements.
Production time depends on material, size, quantity and manufacturing complexity.
Quality control includes:
Material composition analysis
Density testing
Dimension inspection
Surface inspection
Performance verification
Standard targets are produced in common specifications, while custom targets are optimized for your deposition system, film requirements and application conditions.
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